Catalogue of Modules, University of Nottingham

H64PEI Power Electronics Integration
(Last Updated:03 May 2017)

Year  17/18

Total Credits: 10

Level: Level 4

Target Students:  Power Electronics & Drives MSc and MEng Electrical Engineering students  Available to JYA/Erasmus students.

Taught Semesters:

Autumn Assessed by end of Autumn Semester 

Prerequisites: BEng degree in Electrical and Electronic Engineering or equivalent

Corequisites:  None.

Summary of Content:  

This module considers the design and integration of existing and future Power Electronic Devices.

  • Power semiconductor devices: Introduction (review of electrical characteristics, physics);
  • Power module construction (functional components, variants); Layout issues, stray inductance, partial discharge
  • Passive devices: Capacitors (types, characteristics); Wound components
  • Thermal management: Theory, developing thermal models; Analysis of gas and liquid-cooled systems (nat and forced convection)
  • Reliability: Wear-out mechanisms; Reliability testing/qualification; Reliability driven design and physics of failure; Analysis of wear-out mechanisms
  • Integration: Introduction; Schematic to system methodologies; CAD tools (use of); Packaging; Multi-functional components; Examples

    Method and Frequency of Class:

    ActivityNumber Of WeeksNumber of sessionsDuration of a session
    Lecture 6 weeks1 per week2 hours
    Lecture 6 weeks1 per week2 hours

    Activities may take place every teaching week of the Semester or only in specified weeks. It is usually specified above if an activity only takes place in some weeks of a Semester

    Further Activity Details:
    Teaching takes place across a 6 week period with 4 hours of lectures on the same day each week. Breakdown of hours: Tutor led - 24 hours; student directed - 40 hours; assessment/revision - 14 hours.

    Method of Assessment: 

    Assessment TypeWeightRequirements
    Exam 1 100 2 Hour Exam 

    Dr P Evans

    Education Aims:  To introduce students to some key topics in power electronics integration including power semiconductors, passive component technologies, packaging technologies, thermal management, reliability and integrated design. The module will include an introduction to methods of analysis which will be illustrated through a number of application-based design examples.

    Learning Outcomes:  

    By the end of the module, students should be able to: